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1 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n t rue +3.0v to +5.5v rs-232 transceivers sp3222eb/3232eb description features meets true eia/tia-232-f standards from a +3.0v to +5.5v power supply 250kbps transmission rate under load 1 a low-power shutdown with receivers active ( sp3222eb ) interoperable with rs-232 down to +2.7v power source enhanced esd specifications: 15kv human body model 15kv iec1000-4-2 air discharge 8kv iec1000-4-2 contact discharge selection table ? l e d o ms e i l p p u s r e w o p 2 3 2 - s r s r e v i r d 2 3 2 - s r s r e v i e c e r l a n r e t x e s t n e n o p m o c n w o d t u h s l t t e t a t s - 3 f o . o n s n i p b e 2 2 2 3 p s v 5 . 5 + o t v 0 . 3 +224s e ys e y0 2 , 8 1 b e 2 3 2 3 p s v 5 . 5 + o t v 0 . 3 +224o no n6 1 the sp3222eb/3232eb series is an rs-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. the sp3222eb/3232eb series has a high-efficiency, charge-pump power supply that requires only 0.1 f capacitors in 3.3v operation. this charge pump allows the sp3222eb/3232eb series to deliver true rs- 232 performance from a single power supply ranging from +3.0v to +5.5v. the sp3222eb/ 3232eb are 2-driver/2-receiver devices. this series is ideal for portable or hand-held applications such as notebook or palmtop computers. the esd tolerance of the sp3222eb/ 3232eb devices are over 15kv for both human body model and iec1000-4-2 air discharge test methods. the sp3222eb device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. during shutdown, the supply current falls to less than 1 a. v- 1 2 3 4 13 14 15 16 5 6 7 12 11 10 c1+ v+ c1- c2+ c2- r1in r2in gnd v cc t1out t2in 8 9 sp3232eb t1in r1out r2out t2out now available in lead free packaging
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 2 note 1: v+ and v- can have maximum magnitudes of 7v, but their absolute difference cannot exceed 13v. note 2: driver input hysteresis is typically 250mv. absolute maximum ratings these are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. v cc ...................................................... -0.3v to +6.0v v+ (note 1) ...................................... -0.3v to +7.0v v- (note 1) ....................................... +0.3v to -7.0v v+ + |v-| (note 1) ........................................... +13v i cc (dc v cc or gnd current) ......................... 100ma input voltages txin, en ............................................ -0.3v to +6.0v rxin .................................................................. 25v output voltages txout ........................................................... 13.2v rxout ..................................... -0.3v to (v cc + 0.3v) short-circuit duration txout .................................................... continuous storage temperature ...................... -65 c to +150 c power dissipation per package 20-pin ssop (derate 9.25mw/ o c above +70 o c) ........ 750mw 18-pin pdip (derate 15.2mw/ o c above +70 o c) ....... 1220mw 18-pin soic (derate 15.7mw/ o c above +70 o c) ....... 1260mw 20-pin tssop (derate 11.1mw/ o c above +70 o c) ...... 890mw 16-pin ssop (derate 9.69mw/ o c above +70 o c) ........ 775mw 16-pin pdip (derate 14.3mw/ o c above +70 o c) ....... 1 150mw 16-pin wide soic (derate 11.2mw/ o c above +70 o c) .... 900mw 16-pin tssop (derate 10.5mw/ o c above +70 o c) ...... 850mw 16- pin nsoic (derate 13.57mw/ c above +70 c) ...... 1086mw unless otherwise noted, the following specifications apply for v cc = +3.0v to +5.5v with t amb = t min to t max , c 1 to c 4 =0.1 f parameter min. typ. max. units conditions dc characteristics supply current 0.3 1.0 ma no load, t amb = +25 c, v cc = 3.3v, txin = v cc or gnd shutdown supply current 1.0 10 a shdn = gnd, t amb = +25 c, v cc = +3.3v, txin = v cc or gnd logic inputs and receiver outputs input logic threshold low gnd 0.8 v txin, en, shdn, note 2 input logic threshold high 2.0 v cc vv cc = 3.3v, note 2 2.4 v v cc = 5.0v, note 2 input leakage current 0.01 1.0 a txin, en, shdn, t amb = +25 c, v in = 0v to v cc output leakage current 0.05 10 a receivers disabled, v out = 0v to v cc output voltage low 0.4 v i out = 1.6ma output voltage high v cc -0.6 v cc -0.1 v i out = -1.0ma driver outputs output voltage swing 5.0 5.4 v 3k ? load to ground at all driver outputs, t amb = +25 c output resistance 300 ? v cc = v+ = v- = 0v, t out = +2v output short-circuit current 35 60 ma v out = 0v output leakage current 25 av out = 12v,v cc = 0v, or 3.0v to 5.5v, drivers disabled electrical characteristics
3 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n r e t e m a r a p. n i m. p y t. x a ms t i n us n o i t i d n o c s t u p n i r e v i e c e r e g n a r e g a t l o v t u p n i5 2 -5 2 +v w o l d l o h s e r h t t u p n i6 . 0 8 . 0 2 . 1 5 . 1 vv c c v 3 . 3 = v c c v 0 . 5 = h g i h d l o h s e r h t t u p n i5 . 1 8 . 1 4 . 2 4 . 2 vv c c v 3 . 3 = v c c v 0 . 5 = s i s e r e t s y h t u p n i3 . 0v e c n a t s i s e r t u p n i357k ? s c i t s i r e t c a r a h c g n i m i t e t a r a t a d m u m i x a m0 5 2s p b kr l k 3 = ? c , l g n i h c t i w s r e v i r d e n o , f p 0 0 0 1 = y a l e d n o i t a g a p o r p r e v i e c e r5 1 . 0 5 1 . 0 s t l h p c , t u o x r o t n i x r , l f p 0 5 1 = t h l p c , t u o x r o t n i x r , l f p 0 5 1 = e m i t e l b a n e t u p t u o r e v i e c e r0 0 2s n e m i t e l b a s i d t u p t u o r e v i e c e r0 0 2s n w e k s r e v i r d0 0 1s nt | l h p t - h l p t , | b m a 5 2 = o c w e k s r e v i e c e r0 5s nt | l h p t - h l p | e t a r w e l s n o i g e r - n o i t i s n a r t0 3/ v sv c c r , v 3 . 3 = l k 3 = ? t , b m a 5 2 = o , c v 0 . 3 + o t v 0 . 3 - m o r f n e k a t s t n e m e r u s a e m v 0 . 3 - o t v 0 . 3 + r o unless otherwise noted, the following specifications apply for v cc = +3.0v to +5.5v with t amb = t min to t max , c 1 to c 4 =0.1 f. typical values apply at v cc = +3.3v or +5.5v and t amb = 25 o c. electrical characteristics
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 4 figure 1. transmitter output voltage vs load capacitance. figure 2. slew rate vs load capacitance. figure 3. supply current vs load capacitance when transmitting data. unless otherwise noted, the following performance characteristics apply for v cc = +3.3v, 250kbps data rates, all drivers loaded with 3k ? , 0.1 f charge pump capacitors, and t amb = +25 c. 30 25 20 15 10 5 0 0 500 1000 2000 3000 4000 5000 slew rate (v/s) load capacitance (pf) - slew + slew t1 at 250kbps t2 at 15.6kbps all tx loaded 3k // cload figure 4. supply current vs supply voltage. 6 4 2 0 -2 -4 -6 2.7 3 3.5 4 4.5 5 supply voltage (v) transmitter output voltage (v) txout - txout + t1 at 250kbps t2 at 15.6kbps all tx loaded 3k // 1000 pf figure 5. transmitter output voltage vs supply voltage. 35 30 25 20 15 10 5 0 supply current (ma) load capacitance (pf) 0 1000 2000 3000 4000 5000 250kbps 125kbps 20kbps t1 at full data rate t2 at 1/16 data rate all tx loaded 3k // cload 6 4 2 0 -2 -4 -6 0 1000 2000 3000 4000 5000 txout + txout - transmitter output voltage (v) load capacitance (pf) t1 at 250kbps t2 at 15.6kbps all tx loaded 3k // cload 16 14 12 10 8 6 4 2 0 2.7 3 3.5 4 4.5 5 supply current (ma) supply voltage (v) 1 transmitter at 250kbps 1 transmitter at 15.6kbps all transmitters loaded with 3k // 1000pf typical performance characteristics
5 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n e m a nn o i t c n u f r e b m u n n i p b e 2 2 2 3 p s b e 2 3 2 3 p s o s / p i d p o s s p o s s t n e . n o i t a r e p o l a m r o n r o f w o l c i g o l y l p p a . e l b a n e r e v i e c e r . ) e t a t s z - h g i h ( s t u p t u o r e v i e c e r e h t e l b a s i d o t h g i h c i g o l y l p p a 11 - + 1 c. r o t i c a p a c p m u p - e g r a h c r e l b u o d e g a t l o v e h t f o l a n i m r e t e v i t i s o p 22 1 + v. p m u p e g r a h c e h t y b d e t a r e n e g v 5 . 5 + 33 2 - 1 c. r o t i c a p a c p m u p - e g r a h c r e l b u o d e g a t l o v e h t f o l a n i m r e t e v i t a g e n 44 3 + 2 c. r o t i c a p a c p m u p - e g r a h c g n i t r e v n i e h t f o l a n i m r e t e v i t i s o p 55 4 - 2 c. r o t i c a p a c p m u p - e g r a h c g n i t r e v n i e h t f o l a n i m r e t e v i t a g e n 66 5 - v. p m u p e g r a h c e h t y b d e t a r e n e g v 5 . 5 - 77 6 t u o 1 t. t u p t u o r e v i r d 2 3 2 - s r 5 17 14 1 t u o 2 t. t u p t u o r e v i r d 2 3 2 - s r 88 7 n i 1 r. t u p n i r e v i e c e r 2 3 2 - s r 4 16 13 1 n i 2 r. t u p n i r e v i e c e r 2 3 2 - s r 99 8 t u o 1 r. t u p t u o r e v e i c e r s o m c / l t t 3 15 12 1 t u o 2 r. t u p t u o r e v e i c e r s o m c / l t t 0 10 19 n i 1 t. t u p n i r e v i r d s o m c / l t t 2 13 11 1 n i 2 t. t u p n i r e v i r d s o m c / l t t 1 12 10 1 d n g. d n u o r g 6 18 15 1 v c c e g a t l o v y l p p u s v 5 . 5 + o t v 0 . 3 + 7 19 16 1 n d h s . n o i t a r e p o e c i v e d l a m r o n r o f h g i h e v i r d . t u p n i l o r t n o c n w o d t u h s - n o e h t d n a ) t u p t u o z - h g i h ( s r e v i r d e h t n w o d t u h s o t w o l e v i r d . y l p p u s r e w o p d r a o b 8 10 2- . c . n. t c e n n o c o n -4 1 , 1 1- table 1. device pin description pin description
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 6 figure 7. pinout configuration for the sp3232eb figure 6. pinout configurations for the sp3222eb v- 1 2 3 4 17 18 19 20 5 6 7 16 15 14 shdn c1+ v+ c1- c2+ c2- n.c. en r1in gnd v cc t1out n.c. 8 9 10 11 12 13 r2in r2out sp3222eb t2out t1in t2in r1out ssop/tssop v- 1 2 3 4 15 16 17 18 5 6 7 14 13 12 shdn c1+ v+ c1- c2+ c2- en r1in gnd v cc t1out 8 9 10 11 r2in sp3222eb t2out t2in t1in r1out dip/so r2out v- 1 2 3 4 13 14 15 16 5 6 7 12 11 10 c1+ v+ c1- c2+ c2- r1in r2in gnd v cc t1out t2in 8 9 sp3232eb t1in r1out r2out t2out
7 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n figure 8. sp3222eb typical operating circuits figure 9. sp3232eb typical operating circuit sp3222eb 2 4 6 5 3 7 19 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 13 12 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + *c3 c4 + + 0.1 f 0.1 f 8 17 rs-232 outputs rs-232 inputs logic inputs v cc 18 1 5k ? r1in r1out 15 9 5k ? r2in r2out 10 16 logic outputs en 20 shdn *can be returned to either v cc or gnd ssop tssop sp3222eb 2 4 6 5 3 7 17 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 12 11 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + *c3 c4 + + 0.1 f 0.1 f 8 15 rs-232 outputs rs-232 inputs logic inputs v cc 16 1 5k ? r1in r1out 13 9 5k ? r2in r2out 10 14 logic outputs en 18 shdn *can be returned to either v cc or gnd dip/so sp3232eb 1 3 5 4 2 6 16 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 11 10 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + *c3 c4 + + 0.1 f 0.1 f 14 7 rs-232 outputs rs-232 inputs logic inputs v cc 15 5k ? r1in r1out 12 13 5k ? r2in r2out 9 8 logic outputs *can be returned to either v cc or gnd
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 8 description the sp3222eb/3232eb transceivers meet the eia/tia-232 and v.28/v.24 communication protocols and can be implemented in battery- powered, portable, or hand-held applications such as notebook or palmtop computers. the sp3222eb/3232eb devices all feature sipex's proprietary on-board charge pump circuitry that generates 2 x v cc for rs-232 voltage levels from a single +3.0v to +5.5v power supply. this series is ideal for +3.3v-only systems, mixed +3.3v to +5.5v systems, or +5.0v-only systems that require true rs-232 performance. the sp3222eb/3232eb series have drivers that operate at a typical data rate of 250kbps fully loaded. the sp3222eb and sp3232eb are 2-driver/2- receiver devices ideal for portable or hand-held applications. the sp3222eb features a 1 a shutdown mode that reduces power consump- tion and extends battery life in portable systems. its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1 a supply current. theory of operation the sp3222eb/3232eb series are made up of three basic circuit blocks: 1. drivers, 2. receivers, and 3. the sipex proprietary charge pump. drivers the drivers are inverting level transmitters that convert ttl or cmos logic levels to 5.0v eia/tia-232 levels inverted relative to the in- put logic levels. typically, the rs-232 output voltage swing is 5.5v with no load and at least 5v minimum fully loaded. the driver outputs are protected against infinite short-circuits to ground without degradation in reliability. driver outputs will meet eia/tia-562 levels of 3.7v with supply voltages as low as 2.7v. the drivers can guarantee a data rate of 250kbps fully loaded with 3k ? in parallel with 1000pf, ensuring compatibility with pc-to-pc commu- nication software. the slew rate of the driver output is internally limited to a maximum of 30v/ s in order to meet the eia standards (eia rs-232d 2.1.7, paragraph 5). the transition of the loaded output from high to low also meets the monotonicity requirements of the standard. figure 10 shows a loopback test circuit used to the rs-232 drivers. figure 11 shows the test results of the loopback circuit with all drivers active at 120kbps with rs-232 loads in parallel with 1000pf capacitors. figure 12 shows the test results where one driver was active at 250kbps and all drivers loaded with an rs-232 receiver in parallel with a 1000pf capacitor. a solid rs-232 data transmission rate of 250kbps provides compatibility with many designs in personal computer peripherals and lan appli- cations. the sp3222eb driver's output stages are turned off (tri-state) when the device is in shutdown mode. when the power is off, the sp3222eb device permits the outputs to be driven up to 12v. the driver's inputs do not have pull-up resistors. designers should connect unused in- puts to v cc or gnd. in the shutdown mode, the supply current falls to less than 1 a, where shdn = low. when the sp3222eb device is shut down, the device's driver outputs are disabled (tri-stated) and the charge pumps are turned off with v+ pulled down to v cc and v- pulled to gnd. the time required to exit shutdown is typically 100 s. connect shdn to v cc if the shutdown mode is not used.
9 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n figure 11. driver loopback test results at 120kbps figure 12. driver loopback test results at 250 kbps figure 10. sp3222eb/3232eb driver loopback test circuit sp3222eb sp3232eb gnd txin txout c1+ c1- c2+ c2- v+ v- v cc 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + c3 c4 + + 0.1 f 0.1 f logic inputs v cc 5k ? rxin rxout logic outputs en* *shdn 1000pf v cc * sp3222eb only
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 10 receivers the receivers convert eia/tia-232 levels to ttl or cmos logic output levels. the sp3222eb receivers have an inverting tri-state output. these receiver outputs (rxout) are tri- stated when the enable control en = high. in the shutdown mode, the receivers can be active or inactive. en has no effect on txout. the truth table logic of the sp3222eb driver and receiver outputs can be found in table 2 . since receiver input is usually from a transmis- sion line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mv. this ensures that the receiver is virtually immune to noisy transmission lines. should an input be left unconnected, a 5k ? pulldown resistor to ground will commit the output of the receiver to a high state. charge pump the charge pump is a sipex ?atented design (5,306,954) and uses a unique approach com- pared to older less?fficient designs. the charge pump still requires four external capacitors, but uses a four?hase voltage shifting technique to attain symmetrical 5.5v power supplies. the internal power supply consists of a regulated dual charge pump that provides output voltages 5.5v regardless of the input voltage (v cc ) over the +3.0v to +5.5v range. in most circumstances, decoupling the power supply can be achieved adequately using a 0.1 f bypass capacitor at c5 (refer to figures 8 and 9 ). in applications that are sensitive to power-sup- ply noise, decouple v cc to ground with a capaci- tor of the same value as charge-pump capacitor c1. physically connect bypass capacitors as close to the ic as possible. the charge pumps operate in a discontinuous mode using an internal oscillator. if the output voltages are less than a magnitude of 5.5v, the charge pumps are enabled. if the output voltage exceed a magnitude of 5.5v, the charge pumps are disabled. this oscillator controls the four phases of the voltage shifting. a description of each phase follows. phase 1 ?v ss charge storage ?during this phase of the clock cycle, the positive side of capacitors c 1 and c 2 are initially charged to v cc . c l + is then switched to gnd and the charge in c 1 is transferred to c 2 . since c 2 + is connected to v cc , the voltage potential across capacitor c 2 is now 2 times v cc . phase 2 ?v ss transfer ?phase two of the clock con- nects the negative terminal of c 2 to the v ss storage capacitor and the positive terminal of c 2 to gnd. this transfers a negative generated voltage to c 3 . this generated voltage is regu- lated to a minimum voltage of -5.5v. simulta- neous with the transfer of the voltage to c 3 , the positive side of capacitor c 1 is switched to v cc and the negative side is connected to gnd. phase 3 ?v dd charge storage ?the third phase of the clock is identical to the first phase ?the charge transferred in c 1 produces ? cc in the negative terminal of c 1 , which is applied to the negative side of capacitor c 2 . since c 2 + is at v cc , the voltage potential across c 2 is 2 times v cc . phase 4 ?v dd transfer ?the fourth phase of the clock connects the negative terminal of c 2 to gnd, and transfers this positive generated voltage across c 2 to c 4 , the v dd storage capacitor. table 2. sp3222eb truth table logic for shutdown and enable control n d h sn et u o x tt u o x r 00 e t a t s - i r te v i t c a 01 e t a t s - i r te t a t s - i r t 10 e v i t c ae v i t c a 11 e v i t c ae t a t s - i r t
11 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n this voltage is regulated to +5.5v. at this voltage, the internal oscillator is disabled. si- multaneous with the transfer of the voltage to c 4 , the positive side of capacitor c 1 is switched to v cc and the negative side is connected to gnd, allowing the charge pump cycle to begin again. the charge pump cycle will continue as long as the operational conditions for the inter- nal oscillator are present. since both v + and v are separately generated from v cc ; in a no?oad condition v + and v will be symmetrical. older charge pump approaches that generate v from v + will show a decrease in the magnitude of v compared to v + due to the inherent inefficiencies in the design. the clock rate for the charge pump typically operates at 250khz. the external capacitors can be as low as 0.1 f with a 16v breakdown voltage rating. esd tolerance the sp3222eb/3232eb series incorporates ruggedized esd cells on all driver output and receiver input pins. the esd structure is improved over our previous family for more rugged applications and environments sensitive to electrostatic discharges and associated transients. the improved esd tolerance is at least 15kv without damage nor latch-up. there are different methods of esd testing applied: a) mil-std-883, method 3015.7 b) iec1000-4-2 air-discharge c) iec1000-4-2 direct contact the human body model has been the generally accepted esd testing method for semiconduc- tors. this method is also specified in mil-std- 883, method 3015.7 for esd testing. the premise of this esd test is to simulate the human body? potential to store electrostatic energy and discharge it to an integrated circuit. the simulation is performed by using a test model as shown in figure 18 . this method will test the ic? capability to withstand an esd transient during normal handling such as in manufacturing areas where the ics tend to be handled frequently. the iec-1000-4-2, formerly iec801-2, is generally used for testing esd on equipment and systems. for system manufacturers, they must guarantee a certain amount of esd protection since the system itself is exposed to the outside environment and human presence. the premise with iec1000-4-2 is that the system is required to withstand an amount of static electricity when esd is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. the transceiver ic receives most of the esd current when the esd source is applied to the connector pins. the test circuit for iec1000-4-2 is shown on figure 19 . there are two methods within iec1000-4-2, the air discharge method and the contact discharge method. with the air discharge method, an esd voltage is applied to the equipment under test (eut) through air. this simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. the high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. this energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. variables with an air discharge such as approach speed of the object carrying the esd potential to the system and humidity will tend to change the discharge current. for example, the rise time of the discharge current varies with the approach speed.
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 12 figure 13. charge pump ?phase 1 figure 14. charge pump ?phase 2 figure 15. charge pump waveforms figure 16. charge pump ?phase 3 figure 17. charge pump ?phase 4 ch1 2.00v ch2 2.00v m 1.00 s ch1 5.48v 2 1 t t [] t +6v a) c 2+ b) c 2 - gnd gnd -6v v cc = +5v ?v ?v +5v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++ v cc = +5v ?0v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++ v cc = +5v ?v +5v ?v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++ v cc = +5v +10v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++
13 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n the contact discharge method applies the esd current directly to the eut. this method was devised to reduce the unpredictability of the esd arc. the discharge current rise time is constant since the energy is directly transferred without the air-gap arc. in situations such as hand held systems, the esd charge can be directly discharged to the equipment from a person already holding the equipment. the current is transferred on to the keypad or the serial port of the equipment directly and then travels through the pcb and finally to the ic. the circuit models in figures 18 and 19 represent the typical esd testing circuits used for all three methods. the c s is initially charged with the dc power supply when the first switch (sw1) is on. now that the capacitor is charged, the second switch (sw2) is on while sw1 switches off. the voltage stored in the capacitor is then applied through r s , the current limiting resistor, onto the device under test (dut). in esd tests, the sw2 switch is pulsed so that the device under test receives a duration of voltage. figure 18. esd test circuit for human body model figure 19. esd test circuit for iec1000-4-2 r c c s r s sw1 sw2 r c device under t est dc power source c s r s sw1 sw2 r s and r v add up to 330 ? f or iec1000-4-2. r s and r v add up to 330 ? for iec1000-4-2. contact-discharge module r v r c c s r s sw1 sw2 r c device under t est dc power source c s r s sw1 sw2 r v contact-discharge module
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 14 figure 20. esd test waveform for iec1000-4-2 30a i ? 0a 15a t=30ns t ? t=0ns device pin human body iec1000-4-2 tested model air discharge direct contact level driver outputs 15kv 15kv 8kv 4 receiver inputs 15kv 15kv 8kv 4 table 3. transceiver esd tolerance levels for the human body model, the current limiting resistor (r s ) and the source capacitor (c s ) are 1.5k ? an 100pf, respectively. for iec-1000-4-2, the current limiting resistor (r s ) and the source capacitor (c s ) are 330 ? an 150pf, respectively. the higher c s value and lower r s value in the iec1000-4-2 model are more stringent than the human body model. the larger storage capacitor injects a higher voltage to the test point when sw2 is switched on. the lower current limiting resistor increases the current charge onto the test point.
15 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n d eh p ackage: plastic shrink small outline (ssop) dimensions (inches) minimum/maximum (mm) 20?pin a a1 ? l b e a a1 b d e e h l ? 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.278/0.289 (7.07/7.33) 0.205/0.212 (5.20/5.38) 0.0256 bsc (0.65 bsc) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0 /8 (0 /8 ) 16?pin 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.239/0.249 (6.07/6.33) 0.205/0.212 (5.20/5.38) 0.0256 bsc (0.65 bsc) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0 /8 (0 /8 )
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 16 d alternate end pins (both ends) d1 = 0.005" min. (0.127 min.) e p ackage: plastic dual?in?line (narrow) a = 0.210" max. (5.334 max). e1 c ? l a2 a1 = 0.015" min. (0.381min.) b b1 e = 0.100 bsc (2.540 bsc) e a = 0.300 bsc (7.620 bsc) dimensions (inches) minimum/maximum (mm) a2 b b1 c d e e1 l ? 16?pin 0.115/0.195 (2.921/4.953) 0.014/0.022 (0.356/0.559) 0.045/0.070 (1.143/1.778) 0.008/0.014 (0.203/0.356) 0.780/0.800 (19.812/20.320) 0.300/0.325 (7.620/8.255) 0.240/0.280 (6.096/7.112) 0.115/0.150 (2.921/3.810) 0 / 15 (0 /15 ) 18?pin 0.115/0.195 (2.921/4.953) 0.014/0.022 (0.356/0.559) 0.045/0.070 (1.143/1.778) 0.008/0.014 (0.203/0.356) 0.880/0.920 (22.352/23.368) 0.300/0.325 (7.620/8.255) 0.240/0.280 (6.096/7.112) 0.115/0.150 (2.921/3.810) 0 / 15 (0 /15 )
17 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n d eh p ackage: plastic small outline (soic) (wide) dimensions (inches) minimum/maximum (mm) a a1 ? l b e a a1 b d e e h l ? 16?pin 0.090/0.104 (2.29/2.649) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.398/0.413 (10.10/10.49) 0.291/0.299 (7.402/7.600) 0.050 bsc (1.270 bsc) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0 /8 (0 /8 ) 18?pin 0.090/0.104 (2.29/2.649)) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.447/0.463 (11.35/11.74) 0.291/0.299 (7.402/7.600) 0.050 bsc (1.270 bsc) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0 /8 (0 /8 )
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 18 a a2 a1 side view seating plane symbol min nom max a 2.35 - 2.65 a1 0.1 - 0.3 a2 2.05 - 2.55 b 0.31 - 0.51 c 0.2 - 0.33 d e e1 e l 0.4 - 1.27 l1 l2 ?0o-8o ?1 5o - 15o note: dimensions in (mm) 1.27 bsc 1.04 ref 0.25 bsc 16 pin soic jedec ms-013 (aa) variation 10.30 bsc 10.30 dsc 7.50 bsc l1 l 1 1 seating plane gauge plane l2 view c to p view e e e/2 e1 b index area (d/2 x e1/2) e1/2 d 1 2 3 b b see view c c with plating base metal b section b-b
19 date: 02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporatio n seating plane a2 a a1 b see detail ?a? b b seaing plane l1 l ?1 detail a ?2 ?3 c b section b-b e1 e d index area d 2 x 2 e1 12 e symbol min nom max a-- 1.2 a1 0.05 - 0.15 a2 0.8 1 1.05 b 0.19 - 0.3 c 0.09 - 0.2 d 4.9 5 5.1 e e1 4.3 4.4 4.5 e ?1 0o 4o 8o ?2 ?3 l 0.45 0.6 0.75 l1 note: dimensions in (mm) 16 pin tssop jedec mo-153 (ab) variation 6.40 bsc 0.65 bsc 12o ref 12o ref 1.00 ref
date:02/25/05 sp3222eb/3232eb true +3.0 to +5.5v rs-232 transceivers ? copyright 2005 sipex corporation 20 part number temperature range package type sp3222ebca .......................................... 0 ? c to +70 ? c .......................................... 20-pin ssop sp3222ebca/tr ..................................... 0 ? c to +70 ? c .......................................... 20-pin ssop sp3222ebcp .......................................... 0 ? c to +70 ? c ............................................ 18-pin pdip sp3222ebct ........................................... 0 ? c to +70 ? c ........................................ 18-pin wsoic sp3222ebct/tr ..................................... 0 ? c to +70 ? c ........................................ 18-pin wsoic sp3222ebcy .......................................... 0 ? c to +70 ? c ........................................ 20-pin tssop sp3222ebcy/tr ..................................... 0 ? c to +70 ? c ........................................ 20-pin tssop sp3222ebea .......................................... -40 ? c to +85 ? c ........................................ 20-pin ssop sp3222ebea/tr .................................... -40 ? c to +85 ? c ........................................ 20-pin ssop sp3222ebep .......................................... -40 ? c to +85 ? c .......................................... 18-pin pdip sp3222ebet .......................................... -40 ? c to +85 ? c ...................................... 18-pin wsoic sp3222ebet/tr .................................... -40 ? c to +85 ? c ...................................... 18-pin wsoic sp3222ebey .......................................... -40 ? c to +85 ? c ...................................... 20-pin tssop sp3222ebey/tr .................................... -40 ? c to +85 ? c ...................................... 20-pin tssop sp3232ebca .......................................... 0 ? c to +70 ? c .......................................... 16-pin ssop sp3232ebca/tr ..................................... 0 ? c to +70 ? c .......................................... 16-pin ssop sp3232ebcp .......................................... 0 ? c to +70 ? c ............................................ 16-pin pdip sp3232ebct ........................................... 0 ? c to +70 ? c ........................................ 16-pin wsoic sp3232ebct/tr ..................................... 0 ? c to +70 ? c ........................................ 16-pin wsoic sp3232ebcn .......................................... 0 ? c to +70 ? c ......................................... 16-pin nsoic sp3232ebcn/tr .................................... 0 ? c to +70 ? c ......................................... 16-pin nsoic sp3232ebcy .......................................... 0 ? c to +70 ? c ........................................ 16-pin tssop sp3232ebcy/tr ..................................... 0 ? c to +70 ? c ........................................ 16-pin tssop sp3232ebea .......................................... -40 ? c to +85 ? c ........................................ 16-pin ssop sp3232ebea/tr .................................... -40 ? c to +85 ? c ........................................ 16-pin ssop sp3232ebep .......................................... -40 ? c to +85 ? c .......................................... 16-pin pdip sp3232ebet .......................................... -40 ? c to +85 ? c ...................................... 16-pin wsoic sp3232ebet .......................................... -40 ? c to +85 ? c ...................................... 16-pin wsoic sp3232eben ......................................... -40 ? c to +85 ? c ....................................... 16-pin nsoic sp3232eben/tr .................................... -40 ? c to +85 ? c ....................................... 16-pin nsoic sp3232ebey .......................................... -40 ? c to +85 ? c ...................................... 16-pin tssop sp3232ebey/tr .................................... -40 ? c to +85 ? c ...................................... 16-pin tssop corporation analog excellence sipex corporation reserves the right to make changes to any products described herein. sipex does not assume any liability aris ing out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor t he rights of others. headquarters and sales office 233 south hillview drive milpitas, ca 95035 tel: (408) 934-7500 fax: (408) 935-7600 ordering information /tr = tape and reel pack quantity is 1,500 for wsoic, ssop or tssop and 2,500 for nsoic. available in lead free packaging. to order add "-l" suffix to part number. example: sp3232eben/tr = standard; sp3232eben-l/tr = lead free click here to order samples

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